Delta Electronics, a global provider of power management and smart green solutions, will showcase its energy-efficient Grid-to-Chip infrastructure portfolio at the OCP Global Summit 2026 in San Jose, California. The solutions include solid-state transformer (SST)-enabled microgrids integrated with solid oxide fuel cell (SOFC) systems, in-row and in-rack power management, and advanced liquid cooling technologies designed to improve efficiency, enhance reliability and support sustainability in high-density AI infrastructure.
“Building sustainable AI infrastructure requires energy, power delivery, and cooling to work together,” said Austin Tseng, President of Delta Electronics Americas. “Delta brings an end-to-end Grid-to-Chip perspective to these requirements, helping customers plan across the entire infrastructure. By integrating our power and cooling expertise with resilient energy solutions, we help customers deploy and scale AI infrastructure with sustainability and efficiency at its foundation.”
As AI computing requirements grow, data center operators must align energy availability, power delivery, and thermal management to bring new capacity online. Delta connects these critical infrastructure layers through a broad portfolio supporting multiple data center architectures. Its Grid-to-Chip approach helps cloud service providers, colocation providers, and enterprises address infrastructure requirements from onsite energy resources to chip-level cooling.
Delta’s Grid-to-Chip portfolio includes SST-enabled microgrid solutions that help data center operators address power availability and grid constraints. These solutions integrate SOFC systems for on-site generation with energy storage, high-efficiency power conversion enabled by solid-state transformer (SST) technology, and intelligent controls. These solutions help build a more resilient and flexible energy infrastructure to support reliable AI deployment and accelerate time to power. Connecting energy planning with downstream power and cooling requirements helps operators align infrastructure development with available energy resources and phased capacity expansion.
Delta will showcase power solutions supporting multiple architectures. The portfolio includes high-efficiency AC/DC and DC/DC power shelves, 800 VDC and ±400 VDC power delivery solutions, and high-current busbars to support the increasing power requirements of high-density AI systems. These technologies extend Delta’s efficiency focus across power conversion and distribution, helping customers address infrastructure losses and adapt power delivery to evolving rack architectures.
Complementing its power infrastructure, Delta will showcase liquid cooling solutions across the , row, rack, board and chip levels, demonstrating comprehensive thermal management capabilities for increasingly dense AI infrastructure.
At the row level, Delta will highlight its 3MW GoCool system, an end-to-end liquid cooling solution that integrates high-efficiency LTL CDUs with prefabricated modular piping. Alongside the Project Deschutes Open In-Row CDU, which delivers up to 2 MW of cooling at a 3°C approach temperature, with a flow rate of up to 500 GPM and 80 psi available pressure for hyperscale and AI data centers. N+1 sealless pumps, dual power inputs, and hot-swappable pumps and filters with 0.2-micron bypass filtration and a flow-through expansion tank help maintain coolant cleanliness and reduce clogging risks, further supporting reliable operation and easy maintenance. Delta plans to begin mass production of the Project Deschutes Open CDU in Q1 2027.
Additional liquid cooling solutions on display include the 800VDC 3.6MW Liquid-to-Liquid Cooling Distribution Unit (LTL CDU), featuring three hot-swappable 25 kW 800 VDC electric pumps to support zero downtime targets, the 4U In-Rack CDU, a new micro-channel cold plate designed for GPU and switch, and double-side Cooling for Vertical Power Delivery (VPD). At the chip level, Delta further advances thermal management with micro-channel lid structures. Together, these solutions extend Delta’s thermal management capabilities across the cooling infrastructure, supporting customers as AI system requirements evolve.
Delta will participate in two speaking sessions exploring how power, cooling, and onsite energy solutions support efficient, resilient AI infrastructure:
“Delta 800 VDC Power and Cooling Solutions for Data Centers” — October 12, 1:40 p.m., Room LL20BCD. Ralf Pieper, Research and Design Director, Custom Design Business Unit, Delta Electronics, and Mike Tu, Principal Electrical Engineer, NVIDIA, will discuss together how the 800 VDC power architectures, rack-level power delivery, and liquid cooling solutions will play a crucial role in next-generation data centers.
“Microgrids at Scale: Resilient Power Infrastructure for AI Data Centers” — October 13, 12:50 p.m., Expo Hall Theater. Nick Baileys, Energy Infrastructure Solutions Director, Delta Electronics, will explore how onsite generation, energy storage, and advanced controls can help accelerate time to power and support resilient data center operations.
Headquartered in Fremont, CA, Delta Electronics (Americas) is a subsidiary of Delta Electronics, Inc. (TWSE: 2308), a global leader in power management and smart green solutions. operated in the Americas for almost 40 years, with offices, R&D centers, manufacturing, and service facilities across the U.S., Canada, Mexico, Brazil, and more. Our smart, energy-saving solutions serve customers across data centers, IT, telecom, renewable energy and microgrids, EV charging and powertrains, building automation, industrial automation, lighting, and other major industries.
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